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Crystal orientation effects in scratch testing with a spherical indenter

机译:球形压头在划痕测试中的晶体取向效应

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摘要

Spherical scratch tests were conducted in individual grains of a randomly oriented polycrystalline body-centered-cubic (bcc) Ti-Nb alloy. For each grain, scratch tests were conducted at four different levels of normal load, which resulted in varying amounts of plastic strain during indentation. The results show a dependence of the horizontal load component on the crystallographic orientation and on the amount of plastic strain. The component of the horizontal force that resulted from plastic deformation was found to correlate with the active slip systems for the particular grain orientation.
机译:球形划痕测试是在无规取向的多晶体立方(Ticc Nb)Ti-Nb合金的单个晶粒中进行的。对于每种谷物,在四个不同的正常载荷水平下进行了划痕测试,导致压痕过程中产生不同程度的塑性应变。结果表明水平载荷分量对晶体学取向和塑性应变量的依赖性。发现由塑性变形引起的水平力的分量与用于特定晶粒取向的主动滑移系统相关。

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